Call for Papers: ECTC 2015 Advanced Packaging

May 26 – May 29, 2015
Sheraton San Diego Hotel and Marina
San Diego, California, USA
Papers are solicited on all topics pertaining to the advanced packaging of electronic and photonic devices; topics of interest include:
  • 2.5D and 3D technologies
  • Embedded Chip Packages
  • Wafer Level and Fan-out Packages
  • System-in-Package (SiP) and Package-on-Package (PoP)
  • Advanced Flip Chip Packages
  • Advanced Substrates
  • Interposer technologies
  • Novel assembly technologies
  • MEMS and sensor packaging
  • Internet-of-Things
  • Wearable and flexible devices
  • Bio-compatible and medical devices
  • Advanced packaging of optoelectronics
  • Advanced packaging of RF and Power devices
You are invited to submit a 750-word abstract via the ECTC Website
Abstract On-Line Submission opens August, 15th 2014;
Abstracts Due: October 13, 2014

Trillion Sensors Summit

TSensors Summits ( are being organized as forums for the world’s sensor visionaries to present their views on which sensor applications (TApps), sensor types and sensor manufacturing platforms have the potential to fuel sensor market growth to the trillions within a decade. Such forecasted explosion will be a continuation of consumer sensor growth from 10 million units in 2007 (iPhone introduction) to almost 10 billion devices in 2013. 
TSensors visions from TSensors Summits are being processed by a group of volunteers to develop TSensors Roadmap, which will provide recommendations for sensor technology platforms best supporting emerging sensor types. The follow-up phase will focus on financing accelerated development. 

To join our distribution list please click ‘Join Our Email List’ at

ESREF 2014: dedicated CPI - 3D reliability day

ESREF 2014, the “25th EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS“ will be held as a 3-day event between September 30 and October 2, 2014 at the Technische Universität Berlin. 
One day will be dedicated to 3D and CPI (chip package interaction) related reliability and failure issues. The deadline for abstract submission is extended to March 25.

For more information please contact direclty Ingrid De Wolf (chair 3D/CPI session)

e‐BRAINS Workshop at EPFL Feb. 17, 2014

e‐BRAINS Workshop on:
Heterogeneous 3D integration of sensors and circuits for Smart Microsystems
Date: Feb. 17, 2014 
Place: Room QI.E building E Innovation Park – EPFL, Switzerland 

The e-BRAINS workshop included of a series of excellent technical contributions both by consortium members and by external speakers. More than 30 international workshop attendees followed technical presentations listed below:

Presentations are now available for download: Workshop presentations
8:55 – 9:00 Opening
Adrian M. Ionescu, EPFL.
9:00 – 9:30 Overview of the e-BRAINS project
Reinhard Pufall, Infineon, Germany.
9:30 – 10:00 Heterogeneous Sensor Integration for Smart Ambient Intelligence Systems
Peter Ramm, Fraunhofer EMFT, Germany.
10:00 – 10:30 Miniature MEMS-based timing and radio solutions using 3-D integrations
David Ruffieux, CSEM, Switzerland.
10:30 – 10:45 Coffee break
10:45 – 11:15 Robustness and Integration of Nano Sensor Devices
Maaike Taklo, Sintef, Norway.
11:15 – 11:45 CNT sensor arrays for gas sensing
Helene Lepoche1, Hoel Guerrin2, Roland Pohle3, 1CEA-LITEN, France, 2EPFL, Switzerland, 3Siemens, Germany.
11:45 – 12:15 Vertically Stacked SiNW-Based 3D FET for high response pH sensing – a collaborative framework between e-BRAINS and SiNAPS EC projects
Elizabeth Buitrago, EPFL, Switzerland.
12: 15 – 13:45 Lunch
13:45 – 14:15 Compact and Micro-Engineered Power Modules: Power Harvesting, Conditioning, Protection and Storage, Eric Yeatman, Imperial College, UK.
14:15 – 14:30 Nanowire based solar cells for solar energy harvesting, Esther Alarcon Llado, Anna Fontcuberta I Moral, EPFL, Switzerland.
14:30 –15:00 Advances in CNT via technology, John Robertson, University of Cambridge, UK.
15:00 – 15:30 Coffee Break
15:30 – 16:00 Where Micro meets Nano – characterization issue in heterogeneous integration
P.Grabiec, T.Bieniek, G.Janczyk, P.Janus, T.Gotszalk, ITE, Poland
16:00 – 16:30 MEMS reliability testing for heterogeneous integration
Ingrid de Wolf, IMEC, Belgium
16:30 – 17::00 Heterogeneous Integration Technologies for Smart Systems Design
Alan Mathewson, Tyndall, Ireland.
17:00 – 17:30 MEMS and 3D heterogeneous integration: applications and markets
Frederic Breussin, Yole, France.

In the quest for Zero-Power: technologies and applications

The e-BRAINS Consortuim memeber have contributed to the Satellite ESSDERC/ESSCIRC 2013 Workshop "In the quest for Zero-Power: technologies and applications" organized by Prof. Adrian Ionescu, NanoLab, EPFL. The workshop agenda has included following sessions:
  • Keynote:
  • Session 1: Smart Autonomous Systems
  • Session 2: Ultra low power computation & communication
  • Session 3: Heterogenous integration
  • Session 4: Low power sensors and energy scavenging for system integration
  • Session 5: Key Enabling Technologies in Horizon 2020
The e-BRAINS Project slide presentation by Peter Ramm, Fraunhofer Research Institution for Modular Solid State Technologies EMFT, Munich is available on-line.

Underfill Challenges for 3D Interconnect

A participant of e-BRAINS is contributing to a SEMATECH workshop together with other experts in the field of 3D integration. The title of the workshop is "Underfill Challenges for 3D Interconnect" and it will take place at  Doubletree by Hilton 2050 Gateway Place San Jose, California on 9 November, 2012. The event will be open by Peter Ramm, Fraunhofer EMFT Munich and has the following agenda:

8:00 AM – 8:30 AM Registration and Continental Breakfast
8:30 AM – 8:45 AM Welcome; Peter Ramm, Fraunhofer EMFT Munich
8:45 AM – 9:00 AM The Role of SEMATECH; Brian Sapp, SEMATECH
9:00 AM – 9:40 AM 3DIC Markets and Technology Drivers; Charles  Woychik, Invensas
9:40 AM – 10:20 AM Challenges Related to Underfill for European Activities on 3D Integration; Maaike M. V. Taklo, SINTEF
10:20 AM – 10:35 AM Break
10:35 AM – 11:15 AM Thermal  Challenges  for 3D; Ken Goodson, Stanford University
11:15 AM – 11:55 AM Automated Thermo Mechanical Modeling of 3D Chip Stacking; Kamal Karimanal, Cielution LLC
11:55 AM – 1:00 PM Lunch
1:00 PM – 1:40 PM The Current Capabilities and Future Challenges of Acoustic Microscopy (AM) for 3D Interconnect Underfill Inspection; Steven Marvell, Sonoscan
1:40 PM – 2:20 PM X-Ray Microscopy: The Ultimate Inspection Technology for 3D IC Packaging; Yuri Sylvester, Xradia
2:20 PM – 3:00 PM 2012 Industry Survey Results: Underfill Challenges for High Volume Manufacturing; Sunoo Kim, SEMATECH
3:00 PM – 3:30 PM Discussion and Wrap-Up

For more information please visit the workshop website.

Joint e-BRAINS/ESiP Workshop at ESREF2012

The e-Brains Consortium jointly with the ESiP partners is organizing "Heterogeneous 3D integration considered by the perspective of reliability studied in the European projects e-BRAINS and ESiP" at the 23rd European Symposium on Reliability of Electron Devices,
Failure Physics and Analysis om October 1, 2012 in Cagliari, Italy
ESiP Coordinator: Klaus Pressel
e-BRAINS Coordinator: Reinhard Pufall
Chair: Reinhard Pufall Infineon / Peter Ramm Fraunhofer
Reinhard Pufall
Armin Klumpp, Peter Ramm
Maaike Taklo
Alan Mathewson et al. 
Renzo dal Molin
e-BRAINS/ESiP Agenda  15:30 - 18:00
Chair: Klaus Pressel, Infineon
Klaus Pressel, Infineon
Anton Köck, AIT, Austria
Frank Altmann/FhG IWMH and  Franz Schrank /AMS Austria) 
Peter Czurratis, PVA Tepla, Germany
H.J. Albrecht/Siemens, Germany
Stephanie Pesseguier, STMicro France

EUROSIME 2012 (Lisbon)

The e-BRAINS' project partners have contributed to the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2012 Lisbon, Portugal, April 16-17-18, 2012 delivering the keynote [1] and paper [2]. The EuroSimE 2012 held in Lisbon organized locally by  ISQ (E. Dias Lopes) was a successful event with more than 150 registered participants.

[1] "Determination of Interface Fracture Parameters by Shear Testing Using Different Theoretical Approaches" R. Dudek 1, B. Brämer 1, J. Auersperg 1, R. Pufall 2, H. Walter 3, B. Seiler 4, B. Wunderle 5; 1 Fraunhofer ENAS, Micro Materials Center Chemnitz, Germany 2  Infineon Technologies, Munich, Germany 3  Fraunhofer IZM, Berlin, Germany 4  CWM GmbH, Chemnitz, Germany 5  TU Chemnitz, Germany
[2] "Increasing the Robustness for Reliable Packages by Prediction of Delamination by Cohesive Zone Element Simulation" R. Pufall 1, M. Goroll 1, W. Kanert 1, R. Dudek 2; 1 Infineon Technolgies AG, Neubiberg 2  Fraunhofer ENAS, Chemnitz

Keynote Talk at 3DIC

Alan Mathewson (Tyndall Institute, Ireland) has delivered the Keynote Talk "Status of Research and Application Development of 3DIC Technology in Europe" at the IEEE International 3D System Integration Conference (3DIC) Osaka on Feb 1, 2012:
You can find the presentation here.

3DIC 2012 in Osaka

International 3D System Integration Conference
January 31-February 2, 2012, Osaka
3DIC 2011

The IEEE International 3D System Integration Conference (3DIC) will be held at the "Senri Life-Science center" Osaka on January 31-February 2, 2012.
This conference combines the previous ASET and IEEE EDS Society sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich. After the first combined conference in San Francisco 2009, the 2nd IEEE 3D System Integration Conference was held in Munich in 2010. The 3rd conference will be held in Osaka in 2011, rotate to San Francisco in 2012 and then rotate back to Munich in 2013.
3DIC 2011 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design and test methodology and applications.  The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:
3D Integration Technology.  Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration (e.g. for MEMS, NEMS), capacitive coupling, inductive coupling, multilevel epitaxial growth, etc.
3D IC Circuits Technology.  3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D biomedical circuits etc.
3D Applications.  Imaging, memory, processors, communications, networking, wireless, biomedical, MEMS/NEMS etc.
3D Design and Test Methodology.  3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D,  3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.
Presentation abstracts and proposals for panels and tutorials should be submitted on the conference web site: Deadline for papers and proposals is October 31, 2011.   Abstracts are to be one-page text with one-page of figures and drawings. Accepted papers will be due December 14th, 2011.
3DIC2011 Secretariat
C/O Inter Group Corp.
Akasaka-sanno Square Bldg 2-2-12 Akasaka
Minato-ku, Tokyo 107-0052, Japan