Events

Call for Papers: ECTC 2015 Advanced Packaging

26-08-2014
ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE
May 26 – May 29, 2015
Sheraton San Diego Hotel and Marina
San Diego, California, USA
 
Papers are solicited on all topics pertaining to the advanced packaging of electronic and photonic devices; topics of interest include:
  • 2.5D and 3D technologies
  • Embedded Chip Packages
  • Wafer Level and Fan-out Packages
  • System-in-Package (SiP) and Package-on-Package (PoP)
  • Advanced Flip Chip Packages
  • Advanced Substrates
  • Interposer technologies
  • Novel assembly technologies
  • MEMS and sensor packaging
  • Internet-of-Things
  • Wearable and flexible devices
  • Bio-compatible and medical devices
  • Advanced packaging of optoelectronics
  • Advanced packaging of RF and Power devices
You are invited to submit a 750-word abstract via the ECTC Website http://www.ectc.net
Abstract On-Line Submission opens August, 15th 2014;
Abstracts Due: October 13, 2014
SCIPROM