Ultrasound imaging probes for volumetric (3D real time) scanning

Lead partner: Vermon

Technical goals

  • High density integration and 3D interconnection
  • Power dissipation
  • Reduction of form factor
  • Interconnect suitable with US backing functionality.
Stacks Image 530

MEMS integrated design

Demonstrator & challenges

    Design a smart concept of high density matrix based transducer assembly:
  • Methods for making a suitable 2D transducer array (piezoelectric and/or CMUTs (capacitive micromachined ultrasonic transducers))
  • Designs and manufacture of high density (up to 64x64 channels) matrix interconnect backing block using micro fabrication techniques.
  • 3D packaging/integration methods for transducer control electronics compatible with the array footprint (surface of array).
  • Design of customizable system/platform interface.