Technical goals

• Development of a pixel type infrared imager based on an unique combination of advanced 3D integration processing and nano-dimensioned quantum wells, leading to a device with improved properties compared to existing products on the market.
• 3D integration using wafer bonding to transfer the thermistor material onto the Read Out Integrated Circuit (ROIC)
• Wafer level vacuum encapsulation of pixel array
• Focus on: Material combinations, manufacturability, reliability